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SKU: RUVL5SW6XNFI

Infrared Bga Rework Station IR8500 V.2 BGA Machine IR Soldering Station Reballing Kit Motherboard Mobile Phone Chip Repairing

Attributes
Hign-concerned ChemicalNone
OriginMainland China
Model Numberir8500 v.2, ir8500v.2
is_customizedYes
CertificationCE
OperationsManual / Software
DimensionL780mmx W450mmx H260mm
Net Weight18kg
Power220V AC
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Vendor
Mota
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Seller
$ 640.42

Additional information

Weight 21 kg
Dimensions 80 × 40 × 20 cm
Hign-concerned Chemical

None

Origin

Mainland China

Model Number

ir8500 v.2, ir8500v.2

is_customized

Yes

Certification

CE

Operations

Manual / Software

Dimension

L780mmx W450mmx H260mm

Net Weight

18kg

Power

220V AC

Upper Heating

IR

Size of Upper heating

80mm x 80mm

Consumption of upper heating

450W

Size of Bottom heating

400mm x200mm

General power

2050W

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Infrared Bga Rework Station IR8500 V.2 BGA Machine IR Soldering Station Reballing Kit Motherboard Mobile Phone Chip Repairing 1
Infrared Bga Rework Station IR8500 V.2 BGA Machine IR Soldering Station Reballing Kit Motherboard Mobile Phone Chip Repairing
Mota

Instock

$ 640.42
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